With the introduction of deep-submicron and system-on-chip integrated circuits, complex packages are now key components of high-performance electronic designs. Consequently, the inclusion of the electrical behavior of complex IC packages is a necessity to successfully simulate and deliver silicon. To shorten the design cycle, engineers require package-level design and analysis tools that are capable of handling the multilayer, custom-designed packages of flip chip, ball grid arrays (BGA), chip scale packages (CSP) and system-in-package (SiP). TPA addresses those design and analysis needs.
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