Product Features

• Quasi-static electromagnetic field analysis using 3D Boundary Element Method (BEM) and Fast Multipole Method (FMM)
  • Takes into consideration skin effect and conductor loss
  • Extraction of R, L, and C parasitic components

• Automatic partitioning and extraction of parasitics for entire package or partial section thereof:
  • Partition by number of nets and coupling distance
  • Automatic grouping of nets and analysis
  • Sequential analysis of net groups and full matrix reconstruction
    • Spice-compatible/IBIS model including all pins

• Equivalent circuit model creation (SPICE sub-circuits / lumped models)
  • Export for HSpice®, PSpice®, Spectre® RF, and other Berkeley-compatible SPICE tools
  • Cadence DML, Synopsys SPEF, and IBIS .pkg model

  

• CAD import and editing:
  • Import full or partial layouts including layers, pad stacks, nets, bond wires, etc.
  • User interface supports editing of layers, bond wires, solderballs and bumps

• Layout integration through AnsoftLinks™
  • Cadence APD
  • Cadence SiP Digital/RF
  • Mentor Graphics PADS Layout™
  • Sigrity UPD