SIwave™ employs specialized full-wave finite-element engines to compute resonances, reflections, inter-trace coupling, simultaneous switching noise, power/ground bounce, DC voltage/current distributions, near- and far-field radiation patterns on high-speed PCBs and complex IC packages. SIwave can extract complete designs (which include multiple, arbitrarily shaped power/ground layers, vias, signal traces and circuit elements) with unprecedented accuracy and speed, without requiring potentially laborious layout partitioning by the user. SIwave extracts S, Y and Z-parameters; IBIS interconnect models (ICM), displays 3D electromagnetic fields and generates Full-Wave SPICE™ models for subsequent time- and frequency-domain analyses within Nexxim® and DesignerSI™ or third-party SPICE-compatible circuit tools.

An integrated I2R computation module allows engineers to perform pre-, and post-layout DC voltage drop, DC current density, and DC power density analyses to ensure that power distribution networks (PDN) can source the proper power to integrated circuits by ensuring the PDN has the proper bump, ball and pin sizes as well as proper copper weighting to minimize losses. SIwave also interfaces with the ANSYS software portfolio to allow comprehensive multiphysics simulation of electronic components. One option is the ability to export a power distribution map from SIwave into ANSYS Icepak®. This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak simulation technology solves the challenges associated with the dissipation of thermal energy from electronic components that may cause premature component failure due to overheating.

Electromagnetic interference/compatibility testing can be performed for both near- and far-field problems. SIwave utilizes algorithms from HFSS to provide accurate, detailed descriptions of field interactions above and below boards and packages. Combining this with resonant mode simulations allows the user to predict field radiation patterns prior to manufacturing reducing the number of fabrication spins needed to meet the user's needs. SIwave provides valuable insight into sources of EMI that are not obtainable through measurements and provides confidence that any changes made will correct the problems found during testing. Coupling of SIwave with Ansoft Designer, Nexxim and HFSS provides the unique ability to study data dependent radiation patterns from PCBs and packages inside of a housing enclosure.

Design Flow
SIwave™ seamlessly integrates into existing design flows by importing design geometry directly from EDA layout tools (such as Cadence Allegro®/APD, Sigrity UPD, Mentor Graphics Board Station®, Expedition™ and PADS®, Zuken CR5000). The resulting SYZ networks or Full-Wave SPICE™ models can be imported into existing circuit tools, such as Nexxim or other SPICE-compatible tools.