Featured Capabilities

Key features

• Quasistatic 3D electromagnetic field analysis using Method of Moments (MoM) accelerated by Fast Multipole Method (FMM)
  • Includes proximity and skin effect, dielectric and ohmic loss and frequency dependence
  • Pushbutton 3D extraction of resistance (R), partial inductance (L), capacitance (C) and conductance (G) matrices
  • Infinite ground planes can be modeled

• Quasistatic 2D electromagnetic field analysis using the Finite Element Method (FEM)
  • Per-unit-length RLCG parameters for transmission lines
  • Characteristic impedance (Z0) matrices
  • Propagation speed, delay, attenuation, effective permittivity
  • Differential and common-mode parameters
  • Near- and far-end crosstalk coefficients
  • Surface roughness modeling

• Automatic, adaptive meshing
  • TAU mesher for volume meshing
  • 64-bit meshing

  

• Creation of equivalent circuit models (SPICE sub-circuits/ladder type lumped models)
  • 2D
    • Simplorer® sml, Berkeley Spice, , Cadence DML, HSPICE®, HSPICE W Element (tabular frequency dependent), PSpice®, Spectre®, Intel LCF, IBIS ICM
  • 3D
    • Simplorer® sml, Berkeley Spice, Cadence DML, HSPICE, IBIS Package Model, Maxwell® Spice, PSpice, Spectre, IBIS ICM

• Creation of frequency-domain S-parameters
  • AC/DC R and L included in RL(f) model
  • Distributed model
  • Touchstone format supported

• Display of data/visualization of results
  • Matrices of parasitics
  • Current and voltage visualization for conductors
  • Vector and magnitude field plots

  

• Model healing, resolution and fault-tolerant meshing for CAD import

• GDSII import

• User-defined primitives (UDP) for customizable geometric elements/library of parts

• Integrated optimization/parametric solutions (cost option)
  • Geometry and material parameterization
  • Optimization, sensitivity and statistical analysis

• Distributed Analysis for parallel computing (option)

• Dynamic links to Ansoft Designer®, Nexxim® for EM-circuit co-simulation

• Coupled with Simplorer for power system modeling

• One-way thermal analysis link with ANSYS® Mechanical™