Q3D Extractor® is the premier 3D parasitic extraction software tool for engineers designing multi-layer boards, complex IC packages and 3D on-chip passive components. Q3D Extractor efficiently performs the 3D and 2D electromagnetic-field simulation required for the extraction of RLCG parameters from an interconnect structure and automatically generates an equivalent SPICE sub-circuit model. These highly accurate models can then be used to perform signal integrity analysis to study EM phenomena, such as crosstalk, ground bounce, interconnect delays, and ringing, and to understand the performance of high-speed electronic designs.

New in Q3D Extractor v8.1

• Auto-repair of geometries flagged with import errors
• User control of model validation levels
• Ability to choose a model resolution value for objects based on effective thickness.
• Parasolid and Unigraphics geometry import
• Passivity check capability
• 2D Extractor now exports Maxwell Spice (.spc) circuit format