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Product Suites for RF and microwave design
Product Overview
The DesignerRF supports direct, synchronized schematic and layout design entry with sophisticated data visualization and analysis tools for enhanced productivity. Users can easily import IC macro-cell netlists and GDSII or DXF layouts. The product suite includes linear and nonlinear frequency based analyses powered by the Nexxim® high-capacity circuit engine, which provides transistor level accuracy and robust convergence. Solver on Demand technology enables DesignerRF to drive electromagnetic field solvers, HFSS and PlanarEM, as well as circuit simulation software, Nexxim® and Synopsys HSPICE, directly from its stack-up based layout interface. This intuitive interface is ideal for Electrical CAD (ECAD) import, drawing, and parameterization of electromagnetic designs. An integrated stack up design tool along with support for traditional ECAD primitives such as padstacks, traces, wirebonds, and solderballs propel a new state of the art solution for digital and RF engineers. DesignerRF also provides dynamic links to the widely used PCB and IC package design tools, SIwave and Q3D Extractor®, to include their output within the design flow.
Additional design utilities include:
- Calibration wizard
- Smith tool matching utility
- Transmission Line utility
- SPICE macro-cell netlist import wizard
- Component de-embedding
- Filter Synthesis Utility
The DesignerRF product suites are equipped with comprehensive system simulation (time, frequency, and mixed domains) capability. This is ideal for a variety of complex DSP, RF and Microwave wireless communication designs applications
For high-performance RF/mW design, DesignerRF combines system-level behavioral base-band and RF blocks with transistor-level detail for analog circuits along with 3D full-wave electromagnetic detail at the component level to provide accurate system level simulations of EVM, BER, ACPR, IP3, and PAE.
For high-performance analog/RFIC verification, DesignerRF complements existing IC design capture and advanced package layout tools with its built-in planar electromagnetic field solver and HFSS Solver on Demand. Engineers can create accurate models of on-chip passives and board/package interconnects, combine them with detailed analog circuits, and simulate the true interactions between active nonlinear devices and passive parasitics at high frequencies.
Functionality Comparison
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