Presentations

The following presentations were given at the Empowering Profitability Workshop on September 16 - November 14, 2002.

The presentations are in Adobe Portable Document Format (PDF) . To view the presentations, you will need the free Adobe® Acrobat® Reader®.   

Ansoft Presentations

• Circuit Board Design for 10 Gigabit Small Form Factor Pluggable (XFP) Optical Modules
  Bryan Boots, Eldon Staggs, Daniel Wu, Steve Rousselle

• Modeling and Analysis of High-Density Interconnects for RFIC
  Peter Shin, Aaron Edwards, and Denis Soldo

• Full-Wave, High-Speed Packaging Design
  Bill McGinn, Matt Commens, Markus Kopp

• Frequency Selective Surface Design
  Richard Remski, Brian Gray, Liza Ma

• Rapid Elliptic Filter Design for Wireless Communications
  Bernd Mayer and Martin Vogel

• Design of LTCC RF Modules for communication systems
  Ansoft Korea (Sean Kim, Charly Jeung, Robert Myoung, Jason Yun)

• Advanced VCO Design Using Ansoft Designer®
  Moriaki Ueno (Ansoft Japan)

• Sub-Harmonic Mixer Design
  Tony Donisi

• Low-Noise Amplifier Design in MMIC Technology
  Alain Michel

• Power Integrity and Ground Bounce Simulation of High-Speed PCBs
  Bull Ting, Lydia Cheng, Nilson Yu, Mike Brenneman

• The role of monolithic transmission lines in high-speed integrated circuits
  Dr. Behzad Razavi, UCLA

• Linking measurement with simulation
  Stuart Gillen, Hall T. Martin, and Carl Petersen, National Instruments

• Design of End-fire Antennas on Laminated Substrate
  Michel Clénet, Gilbert A. Morin - Defence R&D Canada Jack Litzenberger, Yahia M. M. Antar - Royal Military College of Canada

• Propagation delay in Serpentine Structures
  Praveen Soora, Apple

• Packages Packages (with Ansoft Tools)
  ChipPAC

• XFP: the Ultimate 10 Gb/s Solution
  Dr. Lew Aronson, Finisar

• Modeling capacitance Multi-layer Ceramic Structures
  Heather Tallo, Kyocera

• Analysis of High-speed Differential Line on PCB using HFSS™
  Seungyong Baek, KAIST (Korea Advanced Institute of Science and Technology)

• Design of 3D Integrated LTCC Antenna Switch Module Using HFSS
  LGinnotek

• Design, Measurement and Modeling of LTCC Embedded Inductors and PCB Balanced Devices
  Prof. T.S. Horng, National Sun Yat-Sen Univ.

• Planar Antennas for WLAN Applications
  Kin-Lu Wong, National Sun Yat-Sen Univ.

• Power Integrity Analysis in a split plane PCB
  Feng Yu, Zhejiang University

• Frequency Domain Characterization for Digital Applications
  Dr. Eric Bogatin, GigaTest Labs